Processor |
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Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory |
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Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics |
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Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power |
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Thermal Design Power (TDP) | 100 W |
Technical details |
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Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Servicing status | Baseline Servicing |
Features |
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Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features |
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Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | No |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions |
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Tcase | 84 °C |
Packaging data |
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Package width | 1.69" (43 mm) |
Package depth | 5.39" (137 mm) |
Package height | 4.41" (112 mm) |
Package type | Retail box |
Logistics data |
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Harmonized System (HS) code | 85423119 |
Weight & dimensions |
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Processor package size | 76mm x 56.5mm |
Package width | 1.69" (43 mm) |
Package depth | 5.39" (137 mm) |
Package height | 4.41" (112 mm) |
Other features |
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Maximum internal memory | 1 TB |